BLUENRG-332VC datasheet(58/67 Pages) STMICROELECTRONICS

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7.3

Thermal characteristics

The maximum chip junction temperature (TJmax.) must never exceed the values in general operating conditions.

The maximum chip-junction temperature, TJ max., in degrees Celsius, can be calculated using the equation:

TJmax.=TAmax.+ PDmax×θJA

(1)

where:

•

TA max. is the maximum ambient temperature in °C

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W

•

PD max. is the sum of PINT max. and PI/O max. (PD max. = PINT max. + PI/O max.)

•

PINT max. is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power

PI/O max represents the maximum power dissipation on output pins:

•

PI/O max. = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the applications.

Note:

When the SMPS is used, a portion of the power consumption is dissipated into the external inductor, therefore

reducing the chip power dissipation. This portion depends mainly on the inductor ESR characteristics.

Note:

As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the chip power

consumption.

Note:

RF characteristics (such as: sensitivity, Tx power, consumption) are provided up to 85 °C.

Table 47. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

QFN32 - 5 mm x 5 mm

26.9

ºC/W

Thermal resistance junction-ambient

WLCSP36 - 0.4 mm pitch

BlueNRG-LPS

Thermal characteristics

DS13819 - Rev 4

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