Nexperia

BAS16L

High-speed switching diode

13. Soldering

solder lands

solder resist

occupied area

solder paste

sod882_fr

0.9

0.3

(2×)

R0.05 (8×)

0.6

(2×)

0.7

(2×)

0.4

(2×)

1.3

0.5

(2×)

0.8

(2×)

0.7

Dimensions in mm

Fig. 8. Reflow soldering footprint for DFN1006-2 (SOD882)

BAS16L

All information provided in this document is subject to legal disclaimers.

© Nexperia B.V. 2022. All rights reserved

Product data sheet

1 October 2022

6 / 9