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MPC602EC/D Datasheet(PDF) 7 Page - NXP Semiconductors |
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MPC602EC/D Datasheet(HTML) 7 Page - NXP Semiconductors |
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7 / 26 page ![]() PowerPC 602 RISC Microprocessor Hardware Specifications 7 Table 5 provides the power dissipation for the 602. These are typical values from a limited sample size. Capacitance, Vin = 0 V, f = 1 MHz 4 Cin —15 pF Notes: 1. Excludes test signal pins LSSD_MODE, L1_TSTCLK, L2_TSTCLK, TDI, TMS, TCK, TRST. These pins contain weak active pull up devices and may typically draw 600 µA current. 2. Inputs and outputs contain protective diodes which may typically draw 600 µA at 5.5 V when three- stated. 3. Bidirectional pins contain internal bus keeper circuits which may typically draw 700 µA current at 5.5 V when three-stated. 4. Capacitance is guaranteed by design. Table 5. Power Dissipation Vdd = 3.3 ± 10% V dc, GND = 0 V dc, 0 ≤ T J≤ 105 °C CPU Clock 66.67 MHz 80 MHz Unit Full-On Mode Typical 2:1 Maximum 1.2 1.8 1.4 2.0 W W Typical 3:1 Maximum 1.2 1.8 1.4 2.0 W W Doze Mode 2:1 Typical 150 165 mW 3:1 Typical 150 165 mW Nap Mode1 2:1 Typical 75 100 mW 3:1 Typical 75 100 mW Table 4. DC Electrical Specifications (Continued) Vdd = 3.3 ± 10% V dc, GND = 0 V dc Characteristic Symbol Min Max Unit Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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