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MPC602EC/D Datasheet(PDF) 7 Page - NXP Semiconductors

Part # MPC602EC/D
Description  PowerPC 602TM RISC Microprocessor Hardware Specification
PDF  26 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC602EC/D Datasheet(HTML) 7 Page - NXP Semiconductors

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PowerPC 602 RISC Microprocessor Hardware Specifications
7
Table 5 provides the power dissipation for the 602. These are typical values from a limited sample size.
Capacitance, Vin = 0 V, f = 1 MHz
4
Cin
—15
pF
Notes:
1. Excludes test signal pins LSSD_MODE, L1_TSTCLK, L2_TSTCLK, TDI, TMS, TCK, TRST. These pins
contain weak active pull up devices and may typically draw 600
µA current.
2. Inputs and outputs contain protective diodes which may typically draw 600
µA at 5.5 V when three-
stated.
3. Bidirectional pins contain internal bus keeper circuits which may typically draw 700
µA current at 5.5 V
when three-stated.
4. Capacitance is guaranteed by design.
Table 5. Power Dissipation
Vdd = 3.3
± 10% V dc, GND = 0 V dc, 0 ≤ T
J≤ 105 °C
CPU Clock
66.67 MHz
80 MHz
Unit
Full-On Mode
Typical
2:1
Maximum
1.2
1.8
1.4
2.0
W
W
Typical
3:1
Maximum
1.2
1.8
1.4
2.0
W
W
Doze Mode
2:1
Typical
150
165
mW
3:1
Typical
150
165
mW
Nap Mode1
2:1
Typical
75
100
mW
3:1
Typical
75
100
mW
Table 4. DC Electrical Specifications (Continued)
Vdd = 3.3
± 10% V dc, GND = 0 V dc
Characteristic
Symbol
Min
Max
Unit
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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