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S1DR Datasheet(PDF) 3 Page - Nexperia B.V. All rights reserved

Part # S1DR
Description  200 V, 1 A high power density, standard switching time PNrectifier
PDF  13 Pages
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Manufacturer  NEXPERIA [Nexperia B.V. All rights reserved]
Direct Link  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

S1DR Datasheet(HTML) 3 Page - Nexperia B.V. All rights reserved

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Nexperia
S1DR
200 V, 1 A high power density, standard switching time PN-rectifier
S1DR
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2018. All rights reserved
Product data sheet
10 January 2018
3 / 13
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
200
V
VR
reverse voltage
-
200
V
VRMS
RMS voltage
Tj = 25 °C
-
140
V
IF
forward current
δ = 1 ; Tsp ≤ 135 °C
-
1.4
A
IF(AV)
average forward current δ = 0.5 ; f = 20 kHz; square wave; Tsp ≤
140 °C
-
1
A
IFSM
non-repetitive peak
forward current
tp = 8.3 ms; Tj(init) = 25 °C; single half sine
wave (applied at rated load condition)
-
25
A
[1]
-
735
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[2]
-
1.19
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
-
-
170
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[2]
-
-
105
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
[3]
-
-
15
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Soldering point of cathode tab.



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