DG401_06 datasheet(3/12 Pages) INTERSIL

3 / 12 page

FN3284.11

November 20, 2006

Absolute Maximum Ratings

Thermal Information

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V

GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V

VL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to (V+) +0.3V

Digital Inputs VS, VD (Note 1) . . . . . (V-) -2V to (V+) + 2V or 30mA,

Whichever Occurs First

Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA

Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle, Max) . . 100mA

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±20V (Max)

Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)

Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V (Min)

Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . .

≤20ns

Thermal Resistance (Typical, Note 2)

θJA (°C/W)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

115

TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C

Maximum Storage Temperature Range . . . . . . . . . . . . -65°C to +150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C

(SOIC and TSSOP- Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.

JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Electrical Specifications Test Conditions: V+ = +15V, V- = -15V, V

IN = 2.4V, 0.8V (Note 3), VL = 5V,

Unless Otherwise Specified

PARAMETER

TEST CONDITIONS

TEMP

(°C)

(NOTE 4)

MIN

(NOTE 5)

TYP

(NOTE 4)

MAX

UNITS

DYNAMIC CHARACTERISTICS

Turn-ON Time, tON

RL = 300Ω, CL = 35pF

+25

100

150

Turn-OFF Time, tOFF

+25

100

Break-Before-Make Time Delay (DG403), tD

RL = 300Ω, CL = 35pF

+25

Charge Injection, Q (Figure 3)

CL = 10nF, VG = 0V, RG = 0Ω

+25

OFF Isolation (Figure 4)

RL = 100Ω, CL = 5pF, f = 1MHz

+25

Crosstalk (Channel-to-Channel) (Figure 6)

+25

-90

Source OFF Capacitance, CS(OFF)

f = 1MHz, VS = VD = 0V (Figure 7)

+25

Drain OFF Capacitance, CD(OFF)

+25

Channel ON Capacitance, CD(ON) + CS(ON)

+25

DIGITAL INPUT CHARACTERISTICS

Input Current with VIN Low, IIL

VIN Under Test = 0.8V, All Others = 2.4V

Full

-1

0.005

μA

Input Current with VIN High, IIH

VIN Under Test = 2.4V, All Others = 0.8V

Full

-1

0.005

μA

ANALOG SWITCH CHARACTERISTICS

Analog Signal Range, VANALOG

Full

-15

Drain-Source ON Resistance, rDS(ON)

V+ = 13.5V, V- = -13.5V,

IS =

10mA, VD = ±10V

+25

Full

rDS(ON) Matching Between Channels, ΔrDS(ON) V+ = 16.5V, V- = -16.5V,

IS = -10mA, VD = 5, 0, -5V

+25

Full

Source OFF Leakage Current, IS(OFF)

V+ = 16.5V, V- = -16.5

VD = ±15.5V, VS =

15.5V

+25

-0.5

-0.01

0.5

Full

-5

Drain OFF Leakage Current, ID(OFF)

+25

-0.5

-0.01

0.5

Full

-5

Channel ON Leakage Current, ID(ON) +IS(ON) V± = ±16.5V, VD = VS = ±15.5V

+25

-1

-0.04

Full

-10

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