KTY81-252 datasheet(11/16 Pages) PHILIPS

11 / 16 page

1998 Mar 26

Philips Semiconductors

Product speciﬁcation

Silicon temperature sensors

KTY81-2 series

Table 5

Tape speciﬁcation

Note

1. Measured over 20 devices.

SYMBOL

DIMENSION

SPECIFICATIONS

REMARKS

MIN.

NOM.

MAX.

TOL.

UNIT

body width

4.4

−

4.8

−

body height

−

5.2

−

body thickness

3.6

−

3.9

−

pitch of component

−

12.7

−±1mm

feed hole pitch

−

12.7

−±0.3

cumulative pitch error

−−−±0.1

note 1

feed hole centre to component

centre

−

6.35

−±0.4

to be measured at bottom

of clinch

lead-to-lead distance

−

5.08

−

+0.6/

−0.2 mm

∆h

component alignment

−

at top of body

tape width

−

−±0.5

hold-down tape width

−

−±0.2

hole position

−

+0.7/

−0.5 mm

hold-down tape position

−

0.5

−±0.2

lead wire clinch height

−

16.5

−±0.5

component height

−−

23.25

−

length of snipped leads

−−

−

feed hole diameter

−

−±0.2

total tape thickness

−−

1.2

−

t1 = 0.3 to 0.6

F1, F2

lead to snipped lead distance

−

2.54

−

+0.4/

−0.2 mm

clinch height

−

2.5

−

+0.5/0

(p)

pull-out force

−−−

KTY81-252 Datasheet(PDF) 11 Page - NXP Semiconductors

KTY81-252 Datasheet(HTML) 11 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Datasheet Download

Link URL