1998 Mar 26

12

Philips Semiconductors

Product specification

Silicon temperature sensors

KTY81-2 series

PACKAGE OUTLINE

UNIT

A

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

5.2

5.0

b

0.48

0.40

c

0.45

0.40

D

4.8

4.4

d

1.7

1.4

E

4.2

3.6

L

14.5

12.7

0.7

0.5

e

2.54

L2

L1

(1)

max.

2.5

b1

0.66

0.56

DIMENSIONS (mm are the original dimensions)

Notes

1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.

SOD70

97-05-30

A

L

0

2.5

5 mm

scale

b

c

D

L1

L2

d

E

Plastic near cylindrical single-ended package; 2 in-line leads

SOD70

1

2

e