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MP6546GL Datasheet(PDF) 20 Page - Monolithic Power Systems

Part # MP6546GL
Description  22V, 3A, Peak, 3-Phase BLDC Driver with 1MHz I2C Interface
PDF  24 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP6546GL Datasheet(HTML) 20 Page - Monolithic Power Systems

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MP6546
– 22V, 3A PEAK, 3-PHASE BLDC DRIVER WITH 1MHZ I2C INTERFACE
MP6546 Rev. 1.0
MonolithicPower.com
20
3/20/2023
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2023 MPS. All Rights Reserved.
APPLICATION INFORMATION
Selecting an External Schottky Diode
In applications where thermal shutdown might be
triggered, add a Schottky diode in parallel with
the three-phase outputs to VIN (D1, D2, and D3
for phase A, phase B, and phase C, respectively)
to improve the current capacity and temperature
tolerance range.
In general, it is recommended to use a diode with
a 30V reverse breakdown voltage, 1A forward
continuous current, and SOT-123 package.
Selecting the Input Capacitor
The input capacitors (C1 and C2) can reduce the
device’s switching noise and the surge current
drawn from the input supply. Use larger-value
ceramic capacitors with X5R or X7R dielectrics
for their low ESR and temperature coefficients.
In general, it is recommended to use two ceramic
capacitors (each VIN pin requires a capacitor) of
10
μF rated for at least 25V.
ADDR Pull-Up Power
The MP6546 checks the ADDR level status
100µs after start-up. If the pull-up power rises too
slowly, an incorrect slave address might be set.
It is recommended to pull the ADDR pin to the
3.3V pin if the address is set to 0x09h by the
ADDR pin.
PCB Layout Guidelines
Efficient
PCB
layout
is
critical
for
stable
operation. For the best results, follow the
guidelines below:
1. Use wider copper for the input, output, and
GND-connecting wire to improve thermal
performance.
2. Place GND vias near the input capacitor to
improve thermal performance and reduce
ground impedance.
3. Connect PGND and AGND as close to one
another as possible.
4. Do not to introduce power circuit interference
to the analog circuit.
Top Layer
Bottom Layer
Figure 8: Recommended PCB Layout



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