MP6546

– 22V, 3A PEAK, 3-PHASE BLDC DRIVER WITH 1MHZ I2C INTERFACE

MP6546 Rev. 1.0

MonolithicPower.com

4

3/20/2023

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

© 2023 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1

nFT

Fault indication. The nFT pin is an open-drain output that pulls to logic low when there is

a fault condition.

2

EN

IC enable input. Pull the EN pin to logic high to enter operating mode. This pin is pulled

down internally.

3

ADDR

Slave address selection pin.

4

VCP

Charge pump output. Connect a 1µF, 16V, X7R ceramic capacitor from VCP to VIN.

5,12

VIN

Input power.

6

UA

Phase A output.

7,9

PGND

Power ground.

8

UB

Phase B output.

10

UC

Phase C output.

11

NC

No connection.

13

3.3V

3.3V LDO output. Connect a 4.7µF, 10V, X7R ceramic capacitor from 3.3V to ground.

14

AGND

Analog ground.

15

HA/CS1

Multi-configuration pin. In linear Hall sensor input mode, this pin is the Hall input A signal.

In magnetic angle sensor input mode, this pin is the serial peripheral interface (SPI) chip

selection output.

16

HB/SCK1

Multi-configuration pin. In linear Hall sensor input mode, this pin is the Hall input B signal.

In magnetic angle sensor input mode, this pin is the SPI clock output pin.

17

MISO1

SPI data input pin.

18

MOSI1

SPI data output pin.

19

SDA

I2C interface SDA pin.

20

SCL

I2C interface SCL pin.

ABSOLUTE MAXIMUM RATINGS (1)

VIN .................................................-0.3V to +24V

VCP ........................................... -0.3V to VIN + 5V

VUA, VUB, VUC ......................... -0.3V to VIN + 0.3V

All other pins ...................................-0.3V to +5V

Continuous power dissipation (TA = 25°C) (2)

................................................................... 2.6W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -60°C to +150°C

ESD Ratings

Human body model (HBM) ........................ ±2kV

Charged device model (CDM) ................ ±750V

Recommended Operating Conditions (3)

Supply voltage (VCC) ........................3.5V to 22V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-20 (3mmx4mm)..............48

….....10...°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient thermal resistance,

θ

JA, and the ambient temperature,

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ (MAX)

- TA) / θJA. Exceeding the maximum allowable power dissipation

can cause excessive die temperature, and the regulator may

go into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.