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DS20001373D-page 13

TC1262

Microchip Technology Drawing C04-032 Rev D Sheet 2 of 2

3-Lead Plastic Small Outline Transistor (DB) [SOT-223]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

2.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed 0.127mm per side.

0.84

0.60

b1

Lead Width

0.35

0.23

c

Lead Thickness

6.70

6.30

D

Overall Length

7.30

E

Overall Width

1.80

-

A

Overall Height

4.60 BSC

e1

Outside lead pitch

3

N

Number of Leads

MAX

MIN

Dimension Limits

MILLIMETERS

Units

Molded Package Width

E1

3.30

3.70

6.70

Tab Lead Width

b2

2.90

3.10

Foot Length

L

0.75

-

3.00

-

0.30

0.76

-

3.50

6.50

7.00

NOM

Lead Angle

-

0°

10°

Molded Package Height

1.70

1.50

A2

1.60

Standoff

-

A1

0.02

0.10

Lead Pitch

e

2.30 BSC