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PM6680ATR Datasheet(PDF) 45 Page - STMicroelectronics |
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PM6680ATR Datasheet(HTML) 45 Page - STMicroelectronics |
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45 / 48 page ![]() PM6680A Package mechanical data 45/48 10 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: 1 VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. Very thin: A=1.00 mm Max. 2 Dimensions D2 & E2 are not in accordance with JEDEC. Table 16. VFQFPN 5x5 mechanical data (mm) Dim Min Typ Max A 0.80 0.90 1.00 A1 0 0.02 0.05 A3 0.20 b 0.18 0.25 0.30 D 4.85 5.00 5.15 D2 See exposed pad variations (1) 1. Dimensions D2 & E2 are not in accordance with JEDEC. E 4.85 5.00 5.15 E2 See exposed pad variations (1) e 0.50 L 0.30 0.40 0.50 ddd 0.05 Table 17. Exposed pad variations D2 E2 Min Typ Max Min Typ Max 2.90 3.10 3.20 2.90 3.10 3.20 |
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