1

V+

10

A1

2

D+

9

SCL

3

D±

8

SDA

4

THERM

7

ALERT/THERM2

5

A0

6

GND

Not to scale

Thermal

Pad

3

TMP461-SP

www.ti.com

SBOS876B – SEPTEMBER 2017 – REVISED FEBRUARY 2020

Product Folder Links: TMP461-SP

Submit Documentation Feedback

Copyright © 2017–2020, Texas Instruments Incorporated

(1)

Thermal pad and package lid are internally connected to ground.

5 Pin Configuration and Functions

HKU Package

10-Pin CFP

Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

A0

5

Digital input

Address select. Connect to GND, V+, or leave floating.

A1

10

Digital input

Address select. Connect to GND, V+, or leave floating.

ALERT/THERM2

7

Digital output

Interrupt or SMBus alert output. Can be configured as a second THERM output.

Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.

D–

3

Analog input

Negative connection to remote temperature sensor.

D+

2

Analog input

Positive connection to remote temperature sensor.

GND

6

Ground

Supply ground connection.

SCL

9

Digital input

Serial clock line for SMBus.

Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V if driven by an open-drain output.

SDA

8

Bidirectional digital

input-output

Serial data line for SMBus. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.

THERM

4

Digital output

Thermal shutdown or fan-control pin.

Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.

V+

1

Power supply

Positive supply voltage, 1.7 V to 3.6 V.

Thermal Pad(1)

--

--

The exposed thermal pad of the HKU package should be connected to a wide ground plane for effective

thermal conduction.