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TMP461-SP

SBOS876B – SEPTEMBER 2017 – REVISED FEBRUARY 2020

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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

6 Specifications

6.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)

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MIN

MAX

UNIT

Power supply, V+

–0.3

6

V

Input voltage

THERM, ALERT/THERM2, SDA and SCL only

–0.3

6

V

D+, A0, A1

–0.3

(V+) + 0.3

D– only

–0.3

0.3

Input current

10

mA

Operating temperature

–55

150

°C

Junction temperature, TJ max

150

°C

Storage temperature, Tstg

–60

150

°C

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JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.7

3.3

3.6

V

TA

Operating temperature

–55

125

°C

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For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

TMP461-SP

UNIT

HKU (CFP)

10 PINS

RθJA

Junction-to-ambient thermal resistance

39.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

20.7

°C/W

RθJB

Junction-to-board thermal resistance

20.9

°C/W

ψJT

Junction-to-top characterization parameter

11.7

°C/W

ψJB

Junction-to-board characterization parameter

21.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

8.7

°C/W