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CDC3RL02BYFPR Datasheet(PDF) 4 Page - Texas Instruments

Part # CDC3RL02BYFPR
Description  CDC3RL02 Low Phase-Noise Two-Channel Clock Fan-Out Buffer
PDF  23 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CDC3RL02BYFPR Datasheet(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range, unless otherwise noted. (1)
MIN
MAX
UNIT
VBATT
Voltage range(2)
–0.3
7
V
Voltage range(3)
CLK_REQ_1/2, MCLK_IN
–0.3
VBATT + 0.3
V
VLDO, CLK_OUT_1/2(2)
–0.3
VBATT + 0.3
IIK
Input clamp current at VBATT,
CLK_REQ_1/2, and MCLK_IN
VI < 0
–50
mA
IO
Continuous output current
CLK_OUT1/2
±20
mA
Continuous current through GND, VBATT, VLDO
±50
mA
TJ
Operating virtual junction temperature
–40
150
°C
TA
Operating ambient temperature range
–40
85
°C
Tstg
Storage temperature range
–55
150
°C
(1)
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2)
The input negative-voltage and output voltage ratings can be exceeded if the input and output current ratings are observed.
(3)
All voltage values are with respect to network ground pin.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
Machine Model
200
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500V HBM is possible with the necessary precautions.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250V CDM is possible with the necessary precautions.
6.3 Recommended Operating Conditions
See (1)
MIN
MAX
UNIT
VBATT
Input voltage to internal LDO
2.3
5.5
V
VI
Input voltage
MCLK_IN, CLK_REQ1/2
0
1.89
V
VO
Output voltage
CLK_OUT1/2
0
1.8
V
VIH
High-level input voltage
CLK_REQ1/2
1.3
1.89
V
VIL
Low-level input voltage
CLK_REQ1/2
0
0.5
V
IOH
High-level output current, DC current
–8
mA
IOL
Low-level output current, DC current
8
mA
(1)
All unused inputs of the device must be held at VCC or GND to verify proper device operation. See the Implications of Slow or Floating
CMOS Inputs application note.
CDC3RL02
SCHS371H – NOVEMBER 2009 – REVISED OCTOBER 2024
www.ti.com
4
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: CDC3RL02



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