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TS4990 Datasheet(PDF) 25 Page - STMicroelectronics |
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TS4990 Datasheet(HTML) 25 Page - STMicroelectronics |
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25 / 33 page ![]() DocID9309 Rev 14 25/33 TS4990 Package information 33 5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 5.1 Flip-chip package information Figure 65. Flip-chip pinout (top view) Figure 66. Marking (top view) A C B 1 2 3 Vin- GND BYPASS VOUT2 VCC Vin+ VOUT1 GND STBY A C B 1 2 3 Vin- GND BYPASS VOUT2 VCC Vin+ VOUT1 GND STBY Vin- GND BYPASS VOUT2 VCC Vin+ VOUT1 GND STBY Balls are underneath XXX YWW E XXX YWW E ST logo Product and assembly code: XXX A90 from Tours 90S from Shenzhen Three-digit datecode: YWW E symbol for lead-free only Symbol for lead-free |
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