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TS4990 Datasheet(PDF) 26 Page - STMicroelectronics |
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TS4990 Datasheet(HTML) 26 Page - STMicroelectronics |
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26 / 33 page  Package information TS4990 26/33 DocID9309 Rev 14 Figure 67. Package mechanical data for 9-bump flip-chip package Figure 68. Daisy chain mechanical data The daisy chain sample features two-by-two pin connections. The schematics in Figure 68 illustrate the way pins connect to each other. This sample is used to test continuity on your board. Your PCB needs to be designed the opposite way, so that pins that are unconnected in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested. Die size: 1.60 x 1.60 mm ±30µm Die height (including bumps): 600µm Bump diameter: 315µm ±50µm Bump diameter before reflow: 300µm ±10µm Bump height: 250µm ±40µm Die height: 350µm ±20µm Pitch: 500µm ±50µm Coplanarity: 50µm max 1.60 mm 1.60 mm 0.5mm 0.5mm 0.25mm 1.60 mm 1.60 mm 0.5mm 0.5mm 0.25mm 600µm 100µm 600µm 100µm A C B 1 2 3 1.6mm 1.6mm A C B 1 2 3 1.6mm 1.6mm |
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