VNH9030AQ datasheet(28/39 Pages) STMICROELECTRONICS

28 / 39 page

Table 16. PCB properties

Dimension

Value

Board

Double layer and six layers

Board finish thickness

1.6 mm ±10%

Board dimension

78 mm x 86 mm

Board material

FR4

Cu thickness (outer layers)

0.070 mm

Cu thickness (inner layers)

0.035 mm

Thermal vias spaced on a

1.2 mm x 1.2 mm grid.

Vias pad clearance thickness

0.2 mm

Thermal vias diameter

0.3 mm ±0.08 mm

Cu thickness on vias

0.025 mm

Figure 21. Chipset configuration

Chip 1

RthA

Chip

RthB

RthC

RthAB

RthAC

RthBC

Table 17. RthJ-Amb vs Cu area dissipation

Thermal resistance (°C/W)

Cu 8 cm2

RthA

42.2

24.3

RthB = RthC

49.4

28.2

RthAB = RthAC

10.5

RthBC

19.8

11.2

Note:

The RthJ-PCB is measured on 6L = 8.3 °C/W.

10.1.1

Thermal resistances definition

The values are defined according to the PCB heatsink area:

•

RthHS = RthHSA = RthHSB = high side chip thermal resistance junction to ambient (HSA or HSB in ON state)

•

RthLS = RthLSA = RthLSB = low side chip thermal resistance junction to ambient

•

RthHSLS = RthHSALSB = RthHSBLSA = mutual thermal resistance junction to ambient between high side and

low side chips

•

RthLSLS = RthLSALSB = mutual thermal resistance junction to ambient between low side chip.

VNH9030AQ

Package and PCB thermal data

DS13967 - Rev 8

page 28/39

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