5.4 Thermal Information OPA596

THERMAL METRIC(1)

OPA596

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

165.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

99.1

°C/W

RθJB

Junction-to-board thermal resistance

64.5

°C/W

ψJT

Junction-to-top characterization parameter

42.6

°C/W

ψJB

Junction-to-board characterization parameter

64.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Thermal Information OPA596

THERMAL METRIC(1)

OPA2596

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

143.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50.4

°C/W

RθJB

Junction-to-board thermal resistance

78.7

°C/W

ψJT

Junction-to-top characterization parameter

3.0

°C/W

ψJB

Junction-to-board characterization parameter

77.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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OPA596, OPA2596

SBOSA42B – JUNE 2024 – REVISED DECEMBER 2025

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Product Folder Links: OPA596 OPA2596