ADA4899-1

Rev. B | Page 18 of 20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-012-A A

CONTROLLING DIMENSIONS ARE IN MILLIMETER; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.050)

0.40 (0.016)

0.50 (0.020)

0.25 (0.010)

45°

8°

0°

1.75 (0.069)

1.35 (0.053)

1.65 (0.065)

1.25 (0.049)

SEATING

PLANE

85

4

1

5.00 (0.197)

4.90 (0.193)

4.80 (0.189)

4.00 (0.157)

3.90 (0.154)

3.80 (0.150)

1.27 (0.05)

BSC

6.20 (0.244)

6.00 (0.236)

5.80 (0.228)

0.51 (0.020)

0.31 (0.012)

COPLANARITY

0.10

TOP VIEW

2.29 (0.090)

BOTTOM VIEW

(PINS UP)

2.29 (0.090)

0.10 (0.004)

MAX

Figure 53. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]

(RD-8-1)

Dimensions shown in millimeters and (inches)

1

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

0.50

0.40

0.30

TOP

VIEW

12° MAX

0.70 MAX

0.65 TYP

0.90 MAX

0.85 NOM

0.30

0.23

0.18

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

4

1.60

1.45

1.30

3.25

3.00 SQ

2.75

2.95

2.75 SQ

2.55

5

8

PIN 1

INDICATOR

Figure 54. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

Ordering Quantity

ADA4899-1YRDZ1

–40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

1

ADA4899-1YRDZ-R71

–40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

1,000

ADA4899-1YRDZ-RL1

–40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

2,500

ADA4899-1YCPZ-R21

–40°C to +125°C

8-Lead LFCSP_VD

CP-8-2

250

ADA4899-1YCPZ-R71

–40°C to +125°C

8-Lead LFCSP_VD

CP-8-2

HBC

1,500

ADA4899-1YCPZ-RL1

–40°C to +125°C

8-Lead LFCSP_VD

CP-8-2

HBC

5,000