PR01, PR02, PR03

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Vishay BCcomponents

Revision: 11-Jul-2018

5

Document Number: 28729

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FUNCTIONAL PERFORMANCE

The power that the resistor can dissipate depends on the operating temperature.

Maximum dissipation (Pmax.) in percentage of rated power as a function of the ambient temperature (Tamb)

PR01 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR02 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR01 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

PR02 Temperature rise (

T) at the lead end (soldering point) as a

function of dissipated power at various lead lengths after mounting.

Ambient Temperature in °C

050

70

100

200

Derating

-55

150

20

0

40

60

80

100

50

0

0.4

1.2

0

0.8

10

20

30

40

ΔT

(K)

P (W)

20 mm

15 mm

Ø 0.58 mm Cu-leads



Minimum distance from resistor body to PCB = 1 mm

Ø 0.58 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

1

15 mm

20 mm

ΔT

(K)

P (W)

2

0

70

0

10

20

30

60

50

40

Ø 0.58 mm FeCu-leads



Minimum distance from resistor body to PCB = 1 mm

50

0

0.4

1.2

0

0.8

10

20

30

40

ΔT

(K)

P (W)

15 mm

20 mm

Ø 0.78 mm Cu-leads



Minimum distance from resistor body to PCB = 1 mm

100

0

20

40

60

80

1

15 mm

20 mm

ΔT

(K)

P (W)

02