PR01, PR02, PR03

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Vishay BCcomponents

Revision: 11-Jul-2018

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Document Number: 28729

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TESTS PROCEDURES AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

• IEC 60115-1, generic specification (includes tests)

The test and requirements table contains only the most

important tests. For the full test schedule refer to the

documents listed above.

The tests are carried out in accordance with IEC 60068-2-xx

test method and under standard atmospheric conditions in

accordance with IEC 60068-1, 5.3.

Climatic category LCT / UCT / 56 (rated temperature range:

lower category temperature, upper category temperature;

damp heat, steady state, test duration: 56 days) is valid.

Unless otherwise specified the following values apply:

• Temperature: 15 °C to 35 °C

• Relative humidity: 45 % to 75 %

• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

For performing some of the tests, the components are

mounted on a test board in accordance with IEC 60115-1,

4.31.

In test procedures and requirements table, only the tests

and requirements are listed with reference to the relevant

clauses of IEC 60115-1 and IEC 60068-2-xx test methods.

A short description of the test procedure is also given.

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2-

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS PERMISSIBLE

CHANGE

(

R

max.)

4.4.1

-

Visual examination

No holes; clean surface; no damage

4.4.2

-

Dimensions (outline)

Gauge (mm)

See Straight and Kinked Dimensions

tables 

4.5

-

Resistance

± 5 % R

4.6.1.1

-

Insulation resistance

Maximum voltage (DC) after 1 min;

metal block method

Rins min.: 104 M

4.7

-

Voltage proof

URMS = Uins; 60 s

No breakdown or flashover

4.8

-

Temperature

coefficient

At (20 / -55 / 20) °C

and (20 / 155 / 20) °C

 ± 250 ppm/K

4.16

21 (Ua1)

21 (Ub)

21 (Uc)

Robustness of

terminations

Tensile, bending, and torsion

No damage

R

max.: ± (0.5 % R + 0.05 )

4.17

20 (Ta)

Solderability

+235 °C; 2 s;

solder bath method; SnPb40

Good tinning

(

 95 % covered, no visible damage)

+245 °C; 3 s;

solder bath method; SnAg3Cu0.5

Good tinning

(

 95 % covered, no visible damage)

4.18.2

20 (Tb)

Resistance to

soldering heat

Unmounted components

(260 ± 5) °C; (10 ± 1) s

R

max.: ± (1 % R + 0.05 )

4.19

14 (Na)

Rapid change of

temperature

30 min at -55 °C and

30 min at +200 °C; 5 cycles

No visual damage

PR01:

R

max.: ± (1 % R + 0.05 )

PR02:

R

max.: ± (1 % R + 0.05 )

PR03:

R

max.: ± (2 % R + 0.05 )

4.20

29 (Eb)

Bump

3 x 1500 bumps in three directions; 40 g

No damage

R

max.: ± (0.5 % R + 0.05 )

4.22

6 (Fc)

Vibration

10 sweep cycles per direction;

10 Hz to 2000 Hz;

1.5 mm or 200 m/s2

No damage

R

max.: ± (0.5 % R + 0.05 )