Enhanced Product

AD8512-EP

Rev. 0 | Page 5 of 7

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

±18 V

Input Voltage

±VS

Power Dissipation

See Figure 2

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−55°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

Electrostatic Discharge

(Human Body Model)

2000 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type1

θJA

θJC

Unit

R-8

158

43

°C/W

1

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD-51.

1.0

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

–55

–35

–15

5

25

45

65

85

105

125

AMBIENT TEMPERATURE (°C)

VSY = ±15V

VSY = ±5V

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION