Ordering information

EMIF10-LCD02F3

6/8

Figure 14.

Flip Chip tape and reel specification

Note:

More information is available in the application notes:

N2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and

recommendation for use”

AN1751: "EMI Filters: Recommendations and measurements"

5

Ordering information

Figure 12.

Footprint

Figure 13.

Marking

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

4 ± 0.1

Ø 1.5 ± 0.1

0.69 ± 0.05

2.11

Table 3.

Ordering information

Order code

Marking

Package

Weight

Base qty

Delivery mode

EMIF10-LCD02F3

GY

Flip Chip

5.0 mg

5000

Tape and reel 7”