MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 0

Electrical Characteristics

Freescale Semiconductor

14

2.2

Recommended Operating Conditions

Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.

2.3

Thermal Characteristics

Table 4 describes thermal characteristics of the MSC8113 for the FC-PBGA packages.

Section 4.5, Thermal Considerations provides a detailed explanation of these characteristics.

2.4

DC Electrical Characteristics

This section describes the DC electrical characteristics for the MSC8113. The measurements in Table 5 assume the following

system conditions:

•

•

•

GND

Note:

Table 3. Recommended Operating Conditions

Rating

Symbol

Value

Unit

Core and PLL supply voltage:

1.07 to 1.13

V

I/O supply voltage

3.135 to 3.465

V

Input voltage

V

Operating temperature range:

–40 to 105

°C

Table 4. Thermal Characteristics for the MSC8113

Characteristic

Symbol

FC-PBGA

20

Unit

Natural

Convection

200 ft/min

(1 m/s) airflow

26

21

°C/W

19

15

°C/W

9

°C/W

0.9

°C/W

1

°C/W

Notes:

1.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3.

Per JEDEC JESD51-6 with the board horizontal.

4.

Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on

the top surface of the board near the package.

5.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6.

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.