4

GaAs SPDT Switch

DC - 4.0 GHz

Rev. V4

MASW4030G

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Mounting

The MASW4030G is back-metalized with pd/ni/au (100/1,000, 10,000 Å) metallization. It can be die-mounted

with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat

before attachment.

Eutectic Die Attach:

A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255°C and a

tool temperature of 265°C. When not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be

approximately 290°C.

B. DO NOT expose the MASW4030G to a temperature greater than 320°C for more than 20 seconds. No

more than 3 seconds for scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place the MASW4030G into position. A thin epoxy fillet should be

visible around the perimeter of the chip.

B. Cure epoxy per manufacturer’s recommended schedule.

C. Electrically conductive epoxy may be used by is not required.

Wire Bonding

A. Ball or wedge with 1.0 mil diameter pure gold wire. Thermosonic wirebonding with a nominal stage

temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams

is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable

wirebonds.

B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as

possible; at least three and no more than four bond wires from ground pads to package are recommended.

Handling Precautions

Permanent damage to the MASW4030G may occur if the following precautions are not adhered to:

A. Cleaniness—MASW4030G should be handled in a clean environment. DO NOT attempt to clean unit after

the MASW3040G is installed.

B. Static Sensitivity—All chip handling equipment and personnel should be DC grounded.

C. Transient—Avoid instrument and power supply transients while bias is applied to the MASW4030G. Use

shielded signal and bias cables to minimize inductive pick-up.

D. Bias—Apply voltage to either of the complementary control ports only when the other is grounded. No port

should be allowed to “float”.

E. General Handling—It is recommended that the MASW4030G chip be handled along the long side of the die

with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers.