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PCIMX515CJM6C Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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PCIMX515CJM6C Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 184 page  © Freescale Semiconductor, Inc., 2009. All rights reserved. Preliminary—Subject to Change Without Notice Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX51CEC Rev. 1, 11/2009 IMX51 Package Information Plastic Package Case 2058 13 x 13 mm, 0.5 mm pitch Case 2017 19 x 19 mm, 0.8 mm pitch Ordering Information See Table 1 on page 3 for ordering information. This document contains information on a new product. Specifications and information herein are subject to change without notice. 1 Introduction The i.MX51 multimedia applications processors represent Freescale Semiconductor’s latest addition to a growing family of multimedia-focused products offering high performance processing optimized for lowest power consumption. The i.MX51 processors feature Freescale’s advanced and power-efficient implementation of the ARM Cortex A8™ core, which operates at speeds as high as 800 MHz. Up to 200 MHz DDR2 and mobile DDR DRAM clock rates are supported. These devices are suitable for applications such as the following: • Netbooks (web tablets) • Nettops (internet desktop devices) • Mobile internet devices (MID) • Portable media players (PMP) • Portable navigation devices (PND) • High-end PDAs • Gaming consoles • Automotive navigation and entertainment (see automotive data sheet, IMX51AEC) i.MX51 Applications Processors for Consumer and Industrial Products 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Special Signal Considerations. . . . . . . . . . . . . . . . 12 3 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 14 3.2 Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.3 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 21 3.4 Output Buffer Impedance Characteristics . . . . . . . 28 3.5 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31 3.6 Module Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.7 External Peripheral Interfaces . . . . . . . . . . . . . . . . 60 4 Package Information and Contact Assignments . . . . . . 137 4.1 13 × 13 mm Package Information . . . . . . . . . . . . 137 4.2 19 × 19 mm Package Information . . . . . . . . . . . . 156 4.3 13 × 13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 174 4.4 19 x 19 mm, 0.8 Pitch Ball Map. . . . . . . . . . . . . . 179 5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183 |
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