PIC18F44J50 datasheet(8/12 Pages) MICROCHIP

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PIC18F46J50 FAMILY

DS80436C-page 8

 2010 Microchip Technology Inc.

Data Sheet Clarifications

The following typographic corrections and clarifications

are to be noted for the latest version of the Device Data

Sheet (DS39931C):

1. Module: Special Features (CONFIG2L)

The “T1DIG” feature mentioned in the Device

Data Sheet (DS39931C) is not implemented in

this device family. The feature, associated with

bit 3 of the CONFIG2L Configuration register, is

discussed in Section 26.1 “Configuration

Bits” and Section 2.5.1 “Oscillator Control

For application firmware to switch to the Timer1

clock source, it must first enable the crystal

driver by setting the T1OSCEN bit (T1CON<3>).

The microcontroller will ignore attempts to clock

switch to the Timer1 clock source when the

crystal driver is disabled.

2. Module: DC Characteristics

(Power-Down Current)

Section 29.2 “DC Characteristics: Power-

Down and Supply Current” lists the maximum

Power-Down (IPD) Sleep mode current for

PIC18FXXJ50 devices, operating at VDD = 2.15V

and -40°C, and 25°C at 5

A.

The correct maximum is 6

A.

3. Module: DC Characteristics (Input

Leakage)

In Table 29-7 USB Module Specifications,

electrical parameter D314 indicates the D+ and

D- pin leakage is +/-0.2

A maximum. The

updated specification is +/-0.5

A maximum,

over the -40°C to +85°C temperature range.

The input leakage specification for all other I/O

pins remains unchanged at the +/-0.2

A maxi-

mum level, as indicated by electrical parameters

D060, D061 and D063 (IIL), in Section 29.3 “DC

Characteristics”.

Note:

Corrections are shown in bold. Where

possible, the original bold text formatting

has been removed for clarity.

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