M24M01-HRMN6PSLASHA datasheet(30/37 Pages) STMICROELECTRONICS

Part #	M24M01-HRMN6P/A

Description	1 Mbit serial I²C bus EEPROM

PDF	37 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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30 / 37 page

M24M01-R die description

M24M01-R, M24M01-W, M24M01-HR

30/37

Doc ID 12943 Rev 7

M24M01-R die description

Caution:

As EEPROM cells loose their charge (and so their binary value) when exposed to ultra violet

(UV) light, EEPROM dice delivered in wafer form by STMicroelectronics must never be

exposed to UV light.

Product M24M01-A

●

Wafer size

203 mm (8 inches)

●

Die identification

M24M01, processed in the Rousset fab

Die Layout

●

Die size (X × Y)

2085 × 3605 µm (including scribe line)

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Scribe line

80.0 × 80.0 µm

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Pad opening

90 × 90 µm

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Die identification (at the position shown in Figure 17)

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Pads

Pad contacts (at the positions shown in Figure 17 and

Table 18)

Figure 17.

M24M01-R die plot

Refer to Table 18: Pad coordinates for the pad locations.

Die identification: M24M01

VCC

SCL

SDA

VSS

ai15446

M24M01-HRMN6P/A Datasheet(PDF) 30 Page - STMicroelectronics

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