SL3ICS1002F7AF datasheet(11/51 Pages) NXP

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139037

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Product data sheet

COMPANY PUBLIC

Rev. 3.7 — 9 October 2012

139037

11 of 51

NXP Semiconductors

SL3ICS1002/1202

UCODE G2XM and G2XL

8.1.5 Au bump

• Bump material:

> 99.9% pure Au

• Bump hardness:

35 – 80 HV 0.005

• Bump shear strength:

> 70 MPa

• Bump height:

m

• Bump height uniformity:

– within a die:

± 2

m

– within a wafer:

± 3

m

– wafer to wafer:

± 4

m

• Bump flatness:

± 1.5

m

• Bump size:

– RFP, RFN

60 x 60

m

– TP1, TP2

60 x 60

m

– Bump size variation:

± 5

m

• Under bump metallization:

sputtered TiW

8.1.6 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BL-ID document number: 1093**”

8.1.7 Map file distribution

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BL-ID document number: 1093**”

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