Data Sheet

AD5545/AD5555

Rev. G | Page 23 of 24

OUTLINE DIMENSIONS

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

INL

LSB

DNL

LSB

Resolution

(Bits)

Temperature

Range

Package

Description

Package

Option

Ordering

Qty

AD5545BRUZ

±2

±1

16

−40°C to +85°C

16-Lead TSSOP

RU-16

96

AD5545BRUZ-REEL7

±2

±1

16

−40°C to +85°C

16-Lead TSSOP

RU-16

1000

AD5545CRUZ

±1

±1

16

−40°C to +85°C

16-Lead TSSOP

RU-16

96

AD5545CRUZ-REEL7

±1

±1

16

−40°C to +85°C

16-Lead TSSOP

RU-16

1000

AD5555CRU

±1

±1

14

−40°C to +85°C

16-Lead TSSOP

RU-16

96

AD5555CRU-REEL7

±1

±1

14

−40°C to +85°C

16-Lead TSSOP

RU-16

1000

AD5555CRUZ

±1

±1

14

−40°C to +85°C

16-Lead TSSOP

RU-16

96

AD5555CRUZ-REEL7

±1

±1

14

−40°C to +85°C

16-Lead TSSOP

RU-16

1000

EV-AD5544/45SDZ

Evaluation Board

1

The AD5545/AD5555 contain 3131 transistors. The die size measures 71 mil. × 96 mil., 6816 sq. mil.

2

Z = RoHS Compliant Part.