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MP2452 Datasheet(PDF) 10 Page - Monolithic Power Systems

Part # MP2452
Description  1A, 36V, 1MHz Step-Down Converter
PDF  16 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP2452 Datasheet(HTML) 10 Page - Monolithic Power Systems

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MP2452―1A, 36V, 1MHz, STEP-DOWN CONVERTER
MP2452 Rev. 1.0
www.MonolithicPower.com
10
9/27/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
SS is also associated with FB. Though SS can
be much lower than FB, it can only be slightly
higher than FB. If somehow FB is brought down,
SS follows to track FB. This function is designed
to accommodate the short-circuit recovery
situation. When a short-circuit is removed, the SS
ramps up as if it is a fresh soft-start process. This
prevents output voltage overshoot.
Thermal Shutdown
Thermal shutdown is implemented to prevent the
chip from thermally running away. When the
silicon die temperature is higher than its upper
threshold, it shuts down the whole chip. When
the temperature is lower than its lower threshold,
thermal shutdown is gone so the chip is enabled
again.
Floating Driver and Bootstrap Charging
The floating power MOSFET driver is powered by
an external bootstrap capacitor.
This floating
driver has its own UVLO protection. This UVLO’s
rising threshold is about 2.4V with a hysteresis of
about 300mV. During this UVLO, the SS voltage
of the controller is reset to zero. When the UVLO
is removed, the controller follows soft-start
process.
The bootstrap capacitor is charged and regulated
to about 5V by the dedicated internal bootstrap
regulator. When the voltage between BST and
SW nodes is lower than its regulation, a PMOS
pass transistor connected from VIN to BST is
turned on. The charging current path is from VIN,
BST and then to SW. External circuit should
provide enough voltage headroom to facilitate the
charging.
As long as VIN is sufficiently higher than SW, the
bootstrap capacitor can be charged. When the
power MOSFET is ON, VIN is about equal to SW
so the bootstrap capacitor cannot be charged.
When the external free wheeling diode is on, VIN
to SW difference is the largest so it is the best
period to charge. When there is no current in the
inductor, SW equals to the output voltage VOUT
so the difference between VIN and VOUT can be
used to charge the bootstrap capacitor.
At higher duty cycle operation condition, the time
period available to the bootstrap charging is less
so the bootstrap capacitor may not be charged
sufficiently.
In case the external circuit has not sufficient
voltage and time to charge the bootstrap
capacitor, extra external circuitry can be used to
ensure the bootstrap voltage in normal operation
region.
The floating driver’s UVLO is not communicated
to the controller.
The DC quiescent current of the floating driver is
about 20uA. Make sure the bleeding current at
SW node is at least higher than this number.
Current Comparator and Current Limit
The power MOSFET current is accurately sensed
via a current sense MOSFET. It is then fed to the
high speed current comparator for the current
mode control purpose. The current comparator
takes this sensed current as one of its inputs.
When the power MOSFET is turned on, the
comparator is first blanked till the end of the turn-
on transition to dodge the noise. Then, the
comparator compares the power switch current
with COMP voltage. When the sensed current is
higher than COMP voltage, the comparator
outputs low, turning off the power MOSFET. The
maximum current of the internal power MOSFET
is internally limited cycle by cycle.
Startup and Shutdown
If both VIN and EN are higher than their
appropriate thresholds, the chip starts. The
reference block starts first, generating stable
reference voltage and currents and then the
internal regulator is enabled. The regulator
provides stable supply for the rest circuitries.
While the internal supply rail is up, an internal
timer holds the power MOSFET OFF for about
50us to blank the startup glitches. When the
internal soft-start block is enabled, it first holds its
SS output low to ensure the rest circuitries are
ready and then slowly ramps up.
Three events shut down the chip: EN low, VIN
low,
thermal
shutdown.
In
the
shutdown
procedure, the signaling path is blocked first to
avoid any fault triggering. COMP voltage and the
internal supply rail are pulled down then. The
floating driver is not subject to this shutdown
command but its charging path is disabled.



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