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MP2452 Datasheet(PDF) 10 Page - Monolithic Power Systems |
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MP2452 Datasheet(HTML) 10 Page - Monolithic Power Systems |
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10 / 16 page ![]() MP2452―1A, 36V, 1MHz, STEP-DOWN CONVERTER MP2452 Rev. 1.0 www.MonolithicPower.com 10 9/27/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2010 MPS. All Rights Reserved. SS is also associated with FB. Though SS can be much lower than FB, it can only be slightly higher than FB. If somehow FB is brought down, SS follows to track FB. This function is designed to accommodate the short-circuit recovery situation. When a short-circuit is removed, the SS ramps up as if it is a fresh soft-start process. This prevents output voltage overshoot. Thermal Shutdown Thermal shutdown is implemented to prevent the chip from thermally running away. When the silicon die temperature is higher than its upper threshold, it shuts down the whole chip. When the temperature is lower than its lower threshold, thermal shutdown is gone so the chip is enabled again. Floating Driver and Bootstrap Charging The floating power MOSFET driver is powered by an external bootstrap capacitor. This floating driver has its own UVLO protection. This UVLO’s rising threshold is about 2.4V with a hysteresis of about 300mV. During this UVLO, the SS voltage of the controller is reset to zero. When the UVLO is removed, the controller follows soft-start process. The bootstrap capacitor is charged and regulated to about 5V by the dedicated internal bootstrap regulator. When the voltage between BST and SW nodes is lower than its regulation, a PMOS pass transistor connected from VIN to BST is turned on. The charging current path is from VIN, BST and then to SW. External circuit should provide enough voltage headroom to facilitate the charging. As long as VIN is sufficiently higher than SW, the bootstrap capacitor can be charged. When the power MOSFET is ON, VIN is about equal to SW so the bootstrap capacitor cannot be charged. When the external free wheeling diode is on, VIN to SW difference is the largest so it is the best period to charge. When there is no current in the inductor, SW equals to the output voltage VOUT so the difference between VIN and VOUT can be used to charge the bootstrap capacitor. At higher duty cycle operation condition, the time period available to the bootstrap charging is less so the bootstrap capacitor may not be charged sufficiently. In case the external circuit has not sufficient voltage and time to charge the bootstrap capacitor, extra external circuitry can be used to ensure the bootstrap voltage in normal operation region. The floating driver’s UVLO is not communicated to the controller. The DC quiescent current of the floating driver is about 20uA. Make sure the bleeding current at SW node is at least higher than this number. Current Comparator and Current Limit The power MOSFET current is accurately sensed via a current sense MOSFET. It is then fed to the high speed current comparator for the current mode control purpose. The current comparator takes this sensed current as one of its inputs. When the power MOSFET is turned on, the comparator is first blanked till the end of the turn- on transition to dodge the noise. Then, the comparator compares the power switch current with COMP voltage. When the sensed current is higher than COMP voltage, the comparator outputs low, turning off the power MOSFET. The maximum current of the internal power MOSFET is internally limited cycle by cycle. Startup and Shutdown If both VIN and EN are higher than their appropriate thresholds, the chip starts. The reference block starts first, generating stable reference voltage and currents and then the internal regulator is enabled. The regulator provides stable supply for the rest circuitries. While the internal supply rail is up, an internal timer holds the power MOSFET OFF for about 50us to blank the startup glitches. When the internal soft-start block is enabled, it first holds its SS output low to ensure the rest circuitries are ready and then slowly ramps up. Three events shut down the chip: EN low, VIN low, thermal shutdown. In the shutdown procedure, the signaling path is blocked first to avoid any fault triggering. COMP voltage and the internal supply rail are pulled down then. The floating driver is not subject to this shutdown command but its charging path is disabled. |
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