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HTMS8201FTK Datasheet(PDF) 4 Page - NXP Semiconductors |
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HTMS8201FTK Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 57 page  HTMS1x01_8x01 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.3 — 17 October 2014 152933 4 of 57 NXP Semiconductors HTMS1x01; HTMS8x01 HITAG µ transponder IC 5. Ordering information Table 2. Ordering information Type number Package Name Description Type Version HTMS1001FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG , 210 pF - HTMS1101FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced, 210 pF - HTMS1201FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced+, 210 pF - HTMS8001FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG , 280pF - HTMS8101FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced, 280 pF - HTMS8201FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG Advanced+, 280 pF - HTMS1001FTB/AF XSON3 plastic extremely thin small outline package; no leads; 4 terminals; body 1 1.45 0.5 mm HITAG , 210 pF SOT1122 HTMS1101FTB/AF XSON3 plastic extremely thin small outline package; no leads; 4 terminals; body 1 1.45 0.5 mm HITAG Advanced, 210 pF SOT1122 HTMS1201FTB/AF XSON3 plastic extremely thin small outline package; no leads; 4 terminals; body 1 1.45 0.5 mm HITAG Advanced+, 210 pF SOT1122 HTMS8001FTB/AF XSON3 plastic extremely thin small outline package; no leads; 4 terminals; body 1 1.45 0.5 mm HITAG , 280 pF SOT1122 HTMS8101FTB/AF XSON3 plastic extremely thin small outline package; no leads; 4 terminals; body 1 1.45 0.5 mm HITAG Advanced, 280 pF SOT1122 HTMS8201FTB/AF XSON3 plastic extremely thin small outline package; no leads; 4 terminals; body 1 1.45 0.5 mm HITAG Advanced+, 280 pF SOT1122 HTMS1001FTK/AF HVSON2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 2 0.85 mm HITAG , 210 pF SOT899-1 HTMS1101FTK/AF HVSON2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 2 0.85 mm HITAG Advanced, 210 pF SOT899-1 HTMS1201FTK/AF HVSON2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 2 0.85 mm HITAG Advanced+, 210 pF SOT899-1 HTMS8001FTK/AF HVSON2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 2 0.85 mm HITAG , 280 pF SOT899-1 HTMS8101FTK/AF HVSON2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 2 0.85 mm HITAG Advanced, 280 pF SOT899-1 HTMS8201FTK/AF HVSON2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 2 0.85 mm HITAG Advanced+, 280 pF SOT899-1 |
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