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HTMS8201FTK Datasheet(PDF) 9 Page - NXP Semiconductors |
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HTMS8201FTK Datasheet(HTML) 9 Page - NXP Semiconductors |
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9 / 57 page ![]() HTMS1x01_8x01 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.3 — 17 October 2014 152933 9 of 57 NXP Semiconductors HTMS1x01; HTMS8x01 HITAG µ transponder IC 8.1.1 Fail die identification No inkdots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”. 8.1.2 Map file distribution See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”. |
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