MSF6N40 datasheet(2/6 Pages) BWTECH

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MSF6N40

N-Channel Enhancement Mode Power MOSFET

Publication Order Number: [MSF6N40]

Absolute Maximum Ratings

Symbol

Parameter

Value

Unit

Maximum lead temperature for soldering purposes,

1/8'' from case for 5 seconds

300

°C

TPKG

Maximum Temperature for Soldering @ Package Body for 10

seconds

260

°C

Total Power Dissipation (TC=25°C)

Derating Factor above 25 °C

0.3

W/°C

TSTG

Operating and Storage Temperature Range

-55 to +150

°C

Storage Temperature

150

°C

Notes;

1. Repetitive Rating: Pulse width limited by maximum junction temperature

2. IAS=5.5A, VDD=50V, L=8mH, VG=10V, starting TJ=+25°C.

3. ISD≤5.5A, dI/dt≤100A/μs, VDD≤BVDSS, starting TJ=+25°C.

Thermal Characteristics

Symbol

Parameter

Max.

Units

RθJC

Thermal Resistance, Junction-to-Case

3.3

°C/W

RθJA

Thermal Resistance, Junction-to-Ambient

62.5

Static Characteristics

Symbol

Test Conditions

Min

Typ.

Max.

Units

VGS

VDS = VGS, ID = 250μA

2.0

4.0

*RDS(ON)

VGS = 10 V , ID = 2.75 A

0.8

1.0

BVDSS

VGS = 0 V , ID = 250μA

400

△BV

DSS /△TJ

ID = 250μA, Referenced to 25°C

0.4

IDSS

VDS = 400 V , VGS = 0 V

VDS = 320 V , VGS = 0 V , Tj= 125°C

IGSSF

VDS = 30 V, VDS = 0 V

100

IGSSR

VDS = -30 V, VDS = 0 V

-100

Dynamic Characteristics

Symbol

Test Conditions

Min

Typ.

Max.

Units

td(on)

VDS = 200 V, ID = 5.5 A,

RG = 25 Ω

110

td(off)

190

120

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