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PM0020 Datasheet(PDF) 69 Page - STMicroelectronics

Part # PM0020
Description  STR91xFA Flash programming manual
PDF  87 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

PM0020 Datasheet(HTML) 69 Page - STMicroelectronics

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PM00020
ISC logic description
69/87
12.5
Instruction description & flows
12.5.1
Bypass
The BYPASS instruction enables the 1-bit BYPASS_REGISTER between TDI and TDO,
effectively causing the device to be "bypassed" in a JTAG chain. The Bypass Register is
always loaded with a logic-0 on the rising edge of TCK in the Capture-DR state.
12.5.2
Sample/preload
The SAMPLE/PRELOAD instruction selects the BOUNDARY_REGISTER between TDI and
TDO. It does not, however, interfere with the normal operation of the component pins or
logic in anyway (BS_ON = 0). When this instruction is active the SAMPLE function of the
instruction occurs on the rising edge of TCK that transitions the TAP from Capture-DR state
to the Shift-DR state. At this point the boundary-scan cells at each I/O pin simply sample
and store the state being driven into the pin for the case of inputs and the state being driven
by the pin for outputs. In addition, the state of the tri-state enable signals for outputs are
sampled. This information can then be shifted out within the Shift-DR state through TDO.
As that data is shifted out, data can be shifted in through TDI for the PRELOAD function of
the instruction, which basically takes effect on the falling edge of TCK in the Update-DR
state, causing the shifted-in values to be loaded onto the latched parallel outputs of the
boundary-scan cells. These values are not allowed to drive the pins, however. The purpose
is to pre-load the values at component inputs and outputs so that a following EXTEST, or
CLAMP instruction will cause these well-defined values to be driven onto the pins
immediately upon selection of those instructions, rather than having random, unknown
values at the pins.
12.5.3
Clamp
The CLAMP instruction enables the BYPASS_REGISTER between TDI and TDO. The
purpose of this instruction is to allow the component pins to be "clamped" in a known state
while the device is in "bypass" mode as part of a JTAG chain (BS_ON = 1). Normally, this
instruction should be used in conjunction with SAMPLE/PRELOAD. The desired clamp
values for the component pins should be loaded via the SAMPLE/PRELOAD instruction into
the BOUNDARY_REGISTER. When the CLAMP instruction is updated in the Update-IR
state, the pins will be driven with the values from the BOUNDARY_REGISTER. This allows
the pins of a "bypassed" device to be controlled to a known static state during board testing.
12.5.4
HIGHZ
The HIGHZ instruction enables the BYPASS_REGISTER between TDI and TDO. The
purpose of this instruction is to tri-state all component outputs. The outputs are tri-stated
after this instruction is parallel loaded into the instruction register on the falling edge of TCK
in the Update-IR state. The BYPASS_REGISTER operates exactly as it does when the
BYPASS instruction is active.
12.5.5
EXTEST
The required EXTEST instruction places the IC into an external boundary-test mode and
selects the boundary-scan register to be connected between TDI and TDO. The EXTEST
instruction forces the output pins to drive the values from the BOUNDARY_REGISTER
rather than from the normal internal logic (BS_ON = 1). The BOUNDARY_REGISTER cells



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