UPD75P4308GS datasheet(49/60 Pages) NEC

49 / 60 page

µPD75P4308

12. RECOMMENDED SOLDERING CONDITIONS

Solder the

µPD75P4308 under the following recommended conditions.

For the details on the recommended soldering conditions, refer to Information Document Semiconductor

Device Mounting Technology Manual (C10535E).

For the soldering methods and conditions other than those recommended, consult NEC.

Table 12-1. Soldering Conditions of Surface Mount Type

µPD75P4308GS: 36-pin plastic shrink SOP (300 mil, 0.8-mm pitch)

Soldering method

Soldering conditions

Symbol

Infrared reflow

Package peak temperature: 235˚C, Reflow time: 30 seconds or below

IR35-107-2

(210˚C or higher), Number of reflow processes: 2 max., Exposure limit: 7 daysNote

(after that, prebaking is necessary at 125˚C for 10 hours)

VPS

Package peak temperature: 215˚C, Reflow time: 40 seconds or below

VP15-107-2

(200˚C or higher), Number of reflow processes: 2 max., Exposure limit: 7 daysNote

(after that, prebaking is necessary at 125˚C for 10 hours)

Wave soldering

Solder temperature: 260˚C or below, Flow time: 10 seconds or below,

WS60-107-1

Number of flow processes: 1

Preheating temperature: 120˚C or below (package surface temperature)

Exposure limit: 7 daysNote (after that, prebaking is necessary at 125˚C for

10 hours)

Pin partial heating

Pin temperature: 300˚C or below, Time: 3 seconds or below (per side of device)

–

Note The number of days for storage after the dry pack has been opened. Storage conditions are 25˚C and 65%

RH max.

Caution Do not use two or more soldering methods in combination (except the pin partial heating method).

UPD75P4308GS Datasheet(PDF) 49 Page - NEC