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ECMF02-2HSMX6 Datasheet(PDF) 11 Page - STMicroelectronics |
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ECMF02-2HSMX6 Datasheet(HTML) 11 Page - STMicroelectronics |
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11 / 17 page ![]() DocID025079 Rev 2 11/17 ECMF02-2HSMX6 Package information 17 3 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 25. µQFN-6L dimension definitions Table 3. µQFN-6L dimension values Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.55 1.60 1.65 0.061 0.063 0.065 E 1.30 1.35 1.40 0.051 0.053 0.055 e 0.45 0.50 0.55 0.018 0.020 0.022 L1 0.35 0.45 0.55 0.014 0.018 0.022 L2 0.65 0.75 0.85 0.026 0.030 0.034 D Index area Top view Side view Bottom view E A e L2 L1 b A1 PIN # 1 ID 1 6 3 4 |
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