DocID025079 Rev 2

15/17

ECMF02-2HSMX6

Recommendation on PCB assembly

17

4.5

Reflow profile

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

4.6

PCB layout recommendation

Figure 32. PCB footprint recommendation

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6°C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)

Zdiff according to the application

Via to GND plane