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ADC12062 Datasheet(PDF) 9 Page - National Semiconductor (TI) |
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ADC12062 Datasheet(HTML) 9 Page - National Semiconductor (TI) |
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9 / 20 page ![]() Pin Descriptions AVCC These are the two positive analog supply inputs They should always be connected to the same voltage source but are brought out separately to allow for sepa- rate bypass capacitors Each supply pin should be bypassed to AGND with a 01 mF ceramic capacitor in parallel with a 10 mF tantalum capacitor DVCC This is the positive digital supply input It should always be connected to the same voltage as the analog supply AVCC It should be bypassed to DGND2 with a 01 mF ceramic capacitor in parallel with a 10 mF tantalum capacitor AGND These are the power supply ground pins DGND1 There are separate analog and digital DGND2 ground pins for separate bypassing of the analog and digital supplies The ground pins should be connected to a stable noise-free system ground All of the ground pins should be returned to the same potential AGND is the analog ground for the converter DGND1 is the ground pin for the digital control lines DGND2 is the ground return for the output databus See Section 60 LAYOUT AND GROUNDING for more information DB0 – DB11 These are the TRI-STATE output pins en- abled by RD CS and OE VIN1 VIN2 These are the analog input pins to the mul- tiplexer For accurate conversions no in- put pin (even one that is not selected) should be driven more than 50 mV below ground or 50 mV above VCC MUX OUT This is the output of the on-board analog input multiplexer ADC IN This is the direct input to the 12-bit sam- pling AD converter For accurate conver- sions this pin should not be driven more than 50 mV below AGND or 50 mV above AVCC S0 This pin selects the analog input that will be connected to the ADC12062 during the conversion The input is selected based on the state of S0 when EOC makes its high- to-low transition Low selects VIN1 high selects VIN2 MODE This pin should be tied to DVCC CS This is the active low Chip Select control input When low this pin enables the RD SH and OE inputs This pin can be tied low INT This is the active low Interrupt output When using the Interrupt Interface Mode (Figure 1) this output goes low when a conversion has been completed and indi- cates that the conversion result is avail- able in the output latches This output is always high when RD is held low (Figure 2) EOC This is the End-of-Conversion control out- put This output is low during a conversion RD This is the active low Read control input When RD is low (and CS is low) the INT output is reset and (if OE is high) data ap- pears on the data bus This pin can be tied low OE This is the active high Output Enable con- trol input This pin can be thought of as an inverted version of the RD input (see Fig- ure 6 ) Data output pins DB0 – DB11 are TRI-STATE when OE is low Data appears on DB0 – DB11 only when OE is high and CS and RD are both low This pin can be tied high SH This is the SampleHold control input The analog input signal is held and a new con- version is initiated by the falling edge of this control input (when CS is low) PD This is the Power Down control input This pin should be held high for normal opera- tion When this pin is pulled low the device goes into a low power standby mode VREFa(FORCE) These are the positive and negative volt- VREFb(FORCE) age reference force inputs respectively See Section 4 REFERENCE INPUTS for more information VREFa(SENSE) These are the positive and negative volt- VREFb(SENSE) age reference sense pins respectively See Section 4 REFERENCE INPUTS for more information VREF 16 This pin should be bypassed to AGND with a 01 mF ceramic capacitor TEST This pin should be tied to DVCC 9 |
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