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ADC12062 Datasheet(PDF) 9 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # ADC12062
Description  12-Bit, 1 MHz, 75 mW A/D Converter
PDF  20 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADC12062 Datasheet(HTML) 9 Page - National Semiconductor (TI)

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Pin Descriptions
AVCC
These are the two positive analog supply
inputs They should always be connected
to the same voltage source
but are
brought out separately to allow for sepa-
rate bypass capacitors Each supply pin
should be bypassed to AGND with a
01 mF ceramic capacitor in parallel with a
10 mF tantalum capacitor
DVCC
This is the positive digital supply input It
should always be connected to the same
voltage as the analog supply AVCC It
should be bypassed to DGND2 with a
01 mF ceramic capacitor in parallel with a
10 mF tantalum capacitor
AGND
These are the power supply ground pins
DGND1
There are separate analog and digital
DGND2
ground pins for separate bypassing of the
analog and digital supplies The ground
pins should be connected to a stable
noise-free system ground
All of the
ground pins should be returned to the
same potential
AGND is the analog
ground for the converter DGND1 is the
ground pin for the digital control lines
DGND2 is the ground return for the output
databus See Section 60 LAYOUT AND
GROUNDING for more information
DB0 – DB11
These are the TRI-STATE output pins en-
abled by RD CS and OE
VIN1 VIN2
These are the analog input pins to the mul-
tiplexer For accurate conversions no in-
put pin (even one that is not selected)
should be driven more than 50 mV below
ground or 50 mV above VCC
MUX OUT
This is the output of the on-board analog
input multiplexer
ADC IN
This is the direct input to the 12-bit sam-
pling AD converter For accurate conver-
sions this pin should not be driven more
than 50 mV below AGND or 50 mV above
AVCC
S0
This pin selects the analog input that will
be connected to the ADC12062 during the
conversion The input is selected based on
the state of S0 when EOC makes its high-
to-low transition Low selects VIN1 high
selects VIN2
MODE
This pin should be tied to DVCC
CS
This is the active low Chip Select control
input When low this pin enables the RD
SH and OE inputs This pin can be tied
low
INT
This is the active low Interrupt output
When using the Interrupt Interface Mode
(Figure 1) this output goes low when a
conversion has been completed and indi-
cates that the conversion result is avail-
able in the output latches This output is
always high when RD is held low
(Figure
2)
EOC
This is the End-of-Conversion control out-
put This output is low during a conversion
RD
This is the active low Read control input
When RD is low (and CS is low) the INT
output is reset and (if OE is high) data ap-
pears on the data bus This pin can be tied
low
OE
This is the active high Output Enable con-
trol input This pin can be thought of as an
inverted version of the RD input (see
Fig-
ure 6 ) Data output pins DB0 – DB11 are
TRI-STATE when OE is low Data appears
on DB0 – DB11 only when OE is high and
CS and RD are both low This pin can be
tied high
SH
This is the SampleHold control input The
analog input signal is held and a new con-
version is initiated by the falling edge of
this control input (when CS is low)
PD
This is the Power Down control input This
pin should be held high for normal opera-
tion When this pin is pulled low the device
goes into a low power standby mode
VREFa(FORCE) These are the positive and negative volt-
VREFb(FORCE) age reference force inputs respectively
See Section 4 REFERENCE INPUTS for
more information
VREFa(SENSE) These are the positive and negative volt-
VREFb(SENSE) age reference sense pins respectively
See Section 4 REFERENCE INPUTS for
more information
VREF 16
This pin should be bypassed to AGND with
a 01 mF ceramic capacitor
TEST
This pin should be tied to DVCC
9



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