AT89C51ED2-RDTIM datasheet(8/24 Pages) ATMEL

8 / 24 page

AT89C51RD2 / AT89C51ED2 QualPack

Rev. 0 – 2003 July

4.2 Qualification Test Methods

General Requirements for Plastic packaged CMOS ICs:

Standard

Test Description

Acceptance

MIL-STD 883

Method 1005

Electrical Life Test (Early Failure Rate)

48 hours 140°C

0/300 - 48h

MIL-STD 883

Method 1005

Electrical Life Test (Latent Failure Rate)

1000 hours 140°C Dynamic or Static

0/100 - 500h

MIL-STD 883

Method 3015.7

Electrostatic Discharge HBM

+/-2000v 1.5kOhm/100pF/3 pulses

0/3 per level

JEDEC 78

Latch up

50mW power injection, 50% overvoltage @125°C

0/5 per stress

AEC Q100

Method 005

NVM Endurance

Program Erase Cycles 25°C

0/50 - 10kc

AEC Q100

Method 005

NVM Data Retention

High Temperature Storage 165°C

0/50 - 500h

MIL-STD 883

Method 1010

Temperature Cycling

1000 cycles –65°C/150°C air/air

0/50 - 500c

Atmel

PAQA0184

HAST after Preconditioning

144 hours 130°C/85%RH

0/50 – 96h

EIA

JESD22-A101

85/85 Humidity Test

1000 hours 85°C/85%RH

0/50 - 500h

EIA

JESD22-A110

HAST

336 hours 130°C/85%RH

0/50 - 168h

EIA

JEDEC 20-STD

Preconditioning

Soldering Stress 220°C/235°c/3 times

0/11 per class

MIL-STD 883

Method 2003

Solderability

0/3

MIL-STD 883

Method 2015

Marking Permanency

0/5

AT89C51ED2-RDTIM Datasheet(PDF) 8 Page - ATMEL Corporation

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