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LM317S/NOPB Datasheet(PDF) 30 Page - Texas Instruments |
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LM317S/NOPB Datasheet(HTML) 30 Page - Texas Instruments |
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30 / 48 page ![]() LM117, LM317-N SNVS774P – MAY 2004 – REVISED OCTOBER 2015 www.ti.com Thermal Considerations (continued) Figure 40. Maximum Power Dissipation vs TAMB for the Figure 39. θJA vs Copper (2-oz.) Area for the SOT-223 SOT-223 Package Package 11.3.2.2 Heatsinking the TO-263 (KTT) Package Figure 41 shows for the TO-263 the measured values of θJA for different copper area sizes using a typical PCB with 1-oz. copper and no solder mask over the copper area used for heatsinking. As shown in Figure 41, increasing the copper area beyond 1 square inch produces very little improvement. It must also be observed that the minimum value of θJA for the TO-263 package mounted to a PCB is 32°C/W. Figure 41. θJA vs Copper (1-oz.) Area for the TO-263 Package As a design aid, Figure 42 shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device (assuming θJA is 35°C/W and the maximum junction temperature is 125°C). 30 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N |
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