LM317SSLASHNOPB datasheet(7/48 Pages) TI1

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LM117, LM317-N

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SNVS774P – MAY 2004 – REVISED OCTOBER 2015

7.7 LM317-N Electrical Characteristics

(1)

Some specifications apply over full Operating Temperature Range as noted. Unless otherwise specified, TJ = 25°C, VIN −

VOUT = 5 V, and IOUT = 10 mA.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

TJ = 25°C

1.25

3 V

≤ (VIN − VOUT) ≤ 40 V,

Reference voltage

10 mA

≤ IOUT ≤ IMAX

(1) (over Full Operating Temperature

1.2

1.25

1.3

Range)

TJ = 25°C

0.01

0.04

Line regulation

≤ (VIN − VOUT) ≤ 40 V

(2)

%/V

(over full operating

0.02

0.07

temperature range)

TJ = 25°C

0.1%

0.5%

Load regulation

10 mA

≤ IOUT ≤ IMAX

(1) (2)

(over full operating

0.3%

1.5%

temperature range)

Thermal regulation

20-ms pulse

0.04

0.07

%/W

Adjustment pin current

(over full operating temperature range)

100

μA

10 mA

≤ IOUT ≤ IMAX

(1)

(over full operating

Adjustment pin current change

0.2

μA

≤ (VIN − VOUT) ≤ 40V

temperature range)

(over full operating

Temperature stability

TMIN ≤ TJ ≤ TMAX

temperature range)

(over full operating

Minimum load current

(VIN − VOUT) = 40 V

3.5

temperature range)

TO-3, TO-263 Packages

(over full operating

1.5

2.2

3.4

temperature range)

SOT-223, TO-220

Packages (over full

(VIN − VOUT) ≤ 15 V

1.5

2.2

3.4

operating temperature

range)

Current limit

TO, TO-252 Package (over

full operating temperature

0.5

0.8

1.8

range)

TO-3, TO-263 packages

0.15

0.4

(VIN − VOUT) = 40 V

SOT-223, TO-220 packages

0.15

0.4

TO, TO-252 package

0.075

0.2

RMS output noise, % of VOUT

10 Hz

≤ f ≤ 10 kHz

0.003%

VOUT = 10 V, f = 120 Hz, CADJ = 0 μF (over full operating

temperature range)

Ripple rejection ratio

VOUT = 10V, f = 120 Hz, CADJ = 10 μF (over full operating

temperature range)

Long-term stability

TJ = 125°C, 1000 hrs

0.3%

(1)

IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package.

IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA),

device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any

temperature is : PD(MAX) = ((TJ(MAX) – TA) / θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).

(2)

Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specifications for thermal regulation.

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