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LELBMA-CQ Datasheet(PDF) 4 Page - OSRAM GmbH

Part # LELBMA-CQ
Description  Compact lightsource in SMT technology
PDF  23 Pages
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Manufacturer  OSRAM [OSRAM GmbH]
Direct Link  http://www.osram.com
Logo OSRAM - OSRAM GmbH

LELBMA-CQ Datasheet(HTML) 4 Page - OSRAM GmbH

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2014-09-10
4
Version 2.0
LE RTDUW S2W
Kennwerte
Characteristics (T
S = 25 °C; IF = 700 mA)
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
red
true
green
deep
blue
ultra
white
Wellenlänge des emittierten Lichtes
Wavelength at peak emission
(typ.)
λ
peak
632
520
449
nm
Dominantwellenlänge*
3) Seite 23
(min.)
Dominant wavelength*
3) page 23
(typ.)
(max.)
λ
dom
λ
dom
λ
dom
620
625
632
521
527
533
449
453
457
nm
nm
nm
Spektrale Bandbreite bei 50 %
Φ
rel max
Spectral bandwidth at 50 %
Φ
rel max
(typ.)
∆λ
18
33
25
nm
Farbkoordinate x nach CIE 1931
3) Seite 23(typ.)
Chromaticity coordinate x acc. to CIE
1931*
3) page 23
x
y
0.31
0.32
Abstrahlwinkel bei 50 %
Ι
V (Vollwinkel) (typ.)
Viewing angle at 50 %
Ι
V
2
ϕ
120
Grad
deg.
Durchlassspannung pro Chip
4) Seite 23
(min.)
Forward voltage per chip
4) page 23
(typ.)
(max.)
V
F
V
F
V
F
2.10
2.50
2.90
2.90
3.60
4.20
2.90
3.45
4.00
2.90
3.45
4.00
V
V
V
Sperrstrom
(max.)
Reverse current
I
R
not designed for
reverse operation
µA
Abstrahlende Fläche
(typ.)
Radiating Surface
A
2.1 x 2.1
mm²
Partieller Lichtfluss
Partial flux acc. CIE 127:2007
(typ.)
E/V 120° = x * ΦE/V 180°)
Φ
E/V, 120°
0.82
Thermal resistance junction / solderpad
Wärmewiderstand Sperrschicht / solderpad
R
th JS real
R
th JS real
1.8 (typ.)
2.3 (max.)
K/W
K/W
Thermal resistance junction / solderpad**
Wärmewiderstand Sperrschicht / solderpad**
n
LED = 23 %
(all chips operated simultaneously)
R
th JS el
R
th JS el
1.4 (typ.)
1.8 (max.)
K/W
K/W
*
Einzelgruppen siehe Seite 5
Individual groups on page 5
** R
th basiert auf statistischen Werten
R
th is based on statistic values



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