If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

b

b

b

b

750 mW

(Soldering 10 seconds)

260 C

06V

Operating Conditions

Min

Max

Units

45

55

V

a

70

C

1500

V

(Note 5)

Symbol

Parameter

Conditions

Min

Max

Units

High Level Input Voltage

(except OSC2CLK)

20

V

Low Level Input Voltage

(except OSC2CLK)

08

V

Input Current (except OSC pins)

g

10

m

A

200

mA

(Note 4)

400

m

A

in Low Power Mode

(Note 4)

200

mA

(Note 4)

2mA

in Low Power Mode

(Note 4)

OSCILLATOR PINS

(OSC2CLK)

g

16

mA

OSC2 High Level Input Voltage

24

V

OSC2 Low Level Input Voltage

04

V

MICROPROCESSOR INTERFACE PINS

(D0 – D7 INT DAK TC DRQ RD WR CS A0 – A3)

High Level Output Voltage

V

35

V

Low Level Output Voltage

01

V

04

V

Output TRI-STATE Leakage

g

100

m

A

Current

DISK DRIVE INTERFACE PINS

(MTR0 – 3 DR0 – 3 WDATA WGATE RDATA DIR HDSEL TRK0 WRTPRT RPM STEP DSKCHG INDEX)

Input Hysteresis

250 Typical

mV

Low Level Output Voltage

04

V

Output High Leakage Current

g

100

m

A

High Level Input Voltage

22

V

Low Level Input Voltage

08

V

Note 1

Absolute Maximum Ratings are those values beyond which damage to the device may occur

Note 2

Unless otherwise specified all voltages are referenced to ground

Note 3

These DC Electrical Characteristics are measured staticly and not under dynamic conditions

Note 4

Note 5

Value based on test complying with NSC SOP5-028 human body model ESD testing using the ETS-910 tester

21