6

6

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. LEADS ARE MILD STEEL, SOLDER DIPPED.

3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN

EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.

4. RECOMMENDED PC BOARD HOLE DIAMETERS:

• LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF

LAMP PACKAGE = 1.143/1.067 (0.044/0.042).

• LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS

= 0.965/0.889 (0.038/0.035).

5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE

B, SEE TABLE.

B

Package Dimensions

A

1.14 ± 0.20

(0.045 ± 0.008)

5.80 ± 0.20

(0.228 ± 0.008)

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)

MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004)

SQ. TYP.

CATHODE

LEAD

2.35 (0.093)

MAX.

CATHODE

FLAT

1.14 ± 0.20

(0.045 ± 0.008)

5.80 ± 0.20

(0.228 ± 0.008)

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)

MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004)

SQ. TYP.

CATHODE

LEAD

CATHODE

FLAT

d

1.50 ± 0.15

(0.059 ± 0.006)

PART NO.

d

HLMP-XX10

12.37 ± 0.25

(0.487 ± 0.010)

HLMP-XX17

12.42 ± 0.25

(0.489 ± 0.010)

HLMP-XX26

12.52 ± 0.25

(0.493 ± 0.010)

HLMP-XX32

11.96 ± 0.25

(0.471 ± 0.010)