MPXM2102AS datasheet(587/670 Pages) MOTOROLA

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Motorola Sensor Device Data

www.motorola.com/semiconductors

Mounting and Handling Suggestions

Custom Port Adaptor Installation Techniques

The Motorola MPX silicon pressure sensor is available in a

basic chip carrier cell which is adaptable for attachment

to customer specific housings/ports (Case 344 for 4-pin

devices and Case 867 for 6-pin devices). The basic cell has

chamfered shoulders on both sides which will accept an O-

ring

such

Parker

Seal’s

silicone

O-ring

(p/n#2-015-S-469-40). Refer to Figure 1 for the recommended

O-ring to sensor cell interface dimensions.

The sensor cell may also be glued directly to a custom

housing or port using many commercial grade epoxies or RTV

adhesives which adhere to grade Valox 420, reinforced

polyester resin plastic polysulfone (MPX2040D only). The

epoxy should be dispensed in a continuous bead around the

cell-to-port interface shoulder. Refer to Figure 2. Care must be

taken to avoid gaps or voids in the adhesive bead to help

ensure that a complete seal is made when the cell is joined to

the port. After cure, a simple test for gross leaks should be

performed to ensure the integrity of the cell to port bond.

Submerging the device in water for 5 seconds with full rated

pressure applied to the port nozzle and checking for air

bubbles will provide a good indication. Be sure device is

thoroughly dried after this test.

Figure 2.

ADHESIVE BEAD

Standard Port Attach Connection

Motorola also offers standard port options designed to

accept readily available silicone, vinyl, nylon or polyethylene

tubing for the pressure connection. The inside dimension of

the tubing selected should provide a snug fit over the port

nozzle. Dimensions of the ports may be found in the case

outline drawings. Installation and removal of tubing from the

port nozzle must be parallel to the nozzle to avoid undue stress

which may break the nozzle from the port base. Whether

sensors are used with Motorola’s standard ports or customer

specific housings, care must be taken to ensure that force is

uniformly distributed to the package or offset errors may be

induced.

Electrical Connection

The MPX series pressure sensor is designed to be installed

on a printed circuit board (standard 0.100

″ lead spacing) or to

accept an appropriate connector if installed on a baseplate.

The leads of the sensor may be formed at right angles for

assembly to the circuit board, but one must ensure that proper

leadform techniques and tools are employed. Hand or

“needlenose” pliers should never be used for leadforming

unless they are specifically designed for that purpose.

Industrial leadform tooling is available from various compan-

ies including

Janesville Tool & Manufacturing (608-868-4925).

Refer to Figure 3 for the recommended leadform technique. It

is also important that once the leads are formed, they should

not be straightened and reformed without expecting reduced

durability. The recommended connector for off-circuit board

applications may be supplied by JST Corp. (1-800-292-4243)

in Mount Prospect, IL. The part numbers for the housing and

pins are:

4 Pin Housing: SMP-04V-BC

6 Pin Housing: SMP-06V-BC

Pin: SHF-01T-0.8SS

The crimp tool part number is: YC12.

Figure 1.

.114

.047

.125

.075

.037R

.021

.210

″

CELL

Figure 3. Leadforming

TOP CLAMP AREA

BOTTOM CLAMP AREA

Leads should be securely clamped top

and bottom in the area between the

plastic body and the form being sure

that no stress is being put on plastic

body. The area between dotted lines

represents surfaces to be clamped.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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