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AD9993BBCZ Datasheet(PDF) 24 Page - Analog Devices

Part # AD9993BBCZ
Description  Integrated Mixed-Signal Front End
PDF  57 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD9993BBCZ Datasheet(HTML) 24 Page - Analog Devices

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Data Sheet
AD9993
Rev. A | Page 23 of 56
Table 9 specifies the time between the ADC LVDS data lane
output transitions and the DDR DCO clock edge 50% transition
point.
Table 9. ADC DDR LVDS Data and Strobe Output Setup and
Hold Times Relative to DCO (Guaranteed)
Parameter
Minimum
Unit
|tSU|
400
ps
|tHOLD|
430
ps
Data Period
1000
ps
LVDS LANE TESTING USING PRBS
One pseudorandom binary sequence (PRBS) generator is
included for each ADC LVDS lane and one PRBS detector on
each DAC LVDS lane. The designs for the generator and
detector are implemented as a 23rd-order pseudorandom noise
(PN23) sequence defined by the generator polynomial x23 + x18 + 1.
The initial seed of the generator is programmable so that each
lane can output different values if started simultaneously. The
four seed registers are indexed as described in the ADC Register
Update Indexing section.
DAC PRBS test results are read back on the DAC_A_PRBS_ERRx
and DAC_B_PRBS_ERRx error counter registers. The DAC
input PRBS error counters are enabled and the error counters
cleared by the bits in the DAC_PRBS_CTRL register. ADC
output lane PRBS generation is controlled by the bits in the
PRBS_GEN_CTRL register.
POWER MODE PROGRAMMING
The AD9993 has a POWER_MODES register that allows the
user to place sections of the chip into different power modes.
The PDWN_PIN_FUNC bit programs the function of the
PDWN pin. By default, assertion of PDWN causes the AD9993
to go into full power-down. The clock generator, indexed
ADCs, DACs, and PLL synthesizer are all powered down at
reset. The indexed ADCs have four power modes. See the ADC
Register Update Indexing section for a definition of indexing.
INTERRUPT REQUEST OPERATION
The AD9993 provides an interrupt request signal, ALERT. It is
used to notify the user system of significant on-chip events. The
ALERT pin is an open-drain, active low output.
Eight different event flags provide visibility into the device.
These raw events are located in the INT_RAW register. These
raw events are always latched in the INT register. If the event is
left unmasked, the latched event triggers an external interrupt
on ALERT. INTEN is the interrupt enable register. When an
event is masked, the INT register captures the event in latched
form. A masked event does not cause ALERT to go true.
The eight events that trigger an interrupt (if enabled) are
PLL lock lost
PLL locked
FIFO Warning 1
FIFO Warning 2
ADC A overrange
ADC B overrange
ADC C overrange
ADC D overrange
Interrupt Service Routine
For the interrupt service routine, interrupt request management
starts by selecting the set of events that require host interven-
tion or monitoring using the bits in the INTEN register. For
events requiring host intervention, upon ALERT activation, run
the following routine to clear an interrupt request:
1.
Read the status of the latched bits in the INT register that
are being monitored.
2.
Monitor the unlatched status bits in the INT_RAW register
directly if needed.
3.
Perform any actions that may be required to clear the
interrupt(s).
4.
Read the INT_RAW bits to verify that the actions taken
have cleared the event.
5.
Clear the interrupt by writing 1 to the event flag bit in the
INT register.
TEMPERATURE SENSOR
The AD9993 has a diode-based temperature sensor for
measuring the temperature of the die. The temperature reading
is accessed using the TS_RD_LSB and TS_RD_MSB registers.
The temperature of the die can be calculated as
106
237
,
41
Temp[15:0]
Die
T
DIE
where:
TDIE is the die temperature in degrees Celsius.
Die Temp is the concatenated 16-bit contents of the TD_RD_LSB
and TD_RD_MSB registers. The temperature accuracy is ±7°C
typical over the −40°C to +85°C range with one point
temperature calibration against a known temperature. A typical
plot of the die temperature code readback vs. die temperature is
shown in Figure 31.



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