LP6304B datasheet(5/12 Pages) POWER

5 / 12 page

LP6304B-01

May.-2013

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 5 of 12

Preliminary Datasheet

LP6304B

Absolute Maximum Ratings

Note 1



Input to GND(VIN) ---------------------------------------------------------------------------------------------- -0.3V to 6V



Other Pin to GND --------------------------------------------------------------------------------------------- -0.3V to 6V



Maximum Junction Temperature ---------------------------------------------------------------------------------- 125°C



Operating Junction Temperature Range (TJ) -------------------------------------------------------- -40℃ to 85°C



Storage Temperature Range (TJ) --------------------------------------------------------------------- -65℃ to 150℃



Maximum Soldering Temperature (at leads, 10 sec) -------------------------------------------------------- 260°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Thermal Information



Maximum Power Dissipation (PD,TA=25℃) ---------------------------------------------------------------------- 2.5W



Thermal Resistance (θJA) ------------------------------------------------------------------------------------------ 50℃/W

ESD Susceptibility



HBM(Human Body Mode) --------------------------------------------------------------------------------------------- 2KV



MM(Machine Mode) --------------------------------------------------------------------------------------------------- 200V

LP6304B Datasheet(PDF) 5 Page - Lowpower Semiconductor inc