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MT7697DN Datasheet(PDF) 72 Page - List of Unclassifed Manufacturers

Part # MT7697DN
Description  Internet-of-Things Wireless Connectivity
PDF  84 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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MT7697DN Datasheet(HTML) 72 Page - List of Unclassifed Manufacturers

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MT7697D
Internet-of-Things Wireless Connectivity
© 2016 MediaTek Inc.
Page 72 of 84
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
4.7
Thermal Characteristics
ΘJC assumes that all the heat is dissipated through the top of the package, while ΨJt assumes that the
heat is dissipated through the top, sides, and the bottom of the package. Thus it is suggested to use
ΨJt to estimate the junction temperature.
Table 4-7. Thermal Characteristics
Symbol Description
Performance
Typical
Unit
TJ
Maximum Junction Temperature (Plastic Package)
125
°C
ΘJA
Junction to ambient temperature thermal resistance[1]
19.21
°C/W
ΘJC
Junction to case temperature thermal resistance
7.33
°C/W
ΨJt
Junction to the package thermal resistance[2]
1.65
°C/W
Note 1: JEDEC 51-7 system FR4 PCB size: 76.2mm x 114.3mm
Note 2: 8mm x 8mm QFN-68 package



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