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ADIS1644X/FLEX Datasheet(PDF) 21 Page - Analog Devices |
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ADIS1644X/FLEX Datasheet(HTML) 21 Page - Analog Devices |
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21 / 23 page ![]() Data Sheet ADIS16446 Rev. 0 | Page 21 of 23 APPLICATIONS INFORMATION MOUNTING TIPS The mounting and installation process can influence gyroscope bias repeatability and other key parametric behaviors. To preserve the best performance, use the following guidelines when developing an attachment approach for the ADIS16446: • Focus mounting force at the machine screw locations. • Avoid direct force application on the substrate. • Avoid placing mounting pressure on the package lid, except for the edges that border the exposed side of the substrate. • Use a consistent mounting torque of 28 inch ounces on the mounting hardware. • Avoid placing translational forces on the electrical connector. For additional mounting ideas and tips, refer to the AN-1305 Application Note. POWER SUPPLY CONSIDERATIONS The power supply must be within 3.15 V and 3.45 V for normal operation and optimal performance. During start up, the internal power conversion system starts drawing current when VDD reaches 1.6 V. The internal processor begins initializing when VDD is equal to 2.35 V. After the processor starts, VDD must reach 2.7 V within 128 ms. Also, make sure that the power supply drops below 1.6 V to shut the device down. Using an optional 10 µF external capacitor between VDD and GND is recommended for the filtering of power supply noise. EVALUATION TOOLS Breakout Board, ADIS16IMU2/PCBZ The ADIS1644X/FLEX and ADIS16IMU2/PCBZ accessories (sold separately) provide access to the ADIS16446 through larger connectors that support standard 1 mm ribbon cabling and a simplified method for connecting to an embedded processor platform. These accessories also provide an easy way to connect the ADIS16446 to either the EVAL-ADIS-FX3 or to the older EVAL-ADIS2 evaluation system. Figure 23 provides a mechanical design example for using these two components with the ADIS16446 IMU in a system. Figure 22 provides the pin assignments for J1 on the ADIS16IMU2/PCBZ breakout board. 1 RST 2 SCLK 3 CS 4 DOUT 5 DNC 6 DIN 7 GND 8 GND 9 GND 10 VDD 11 VDD 12 VDD 13 DIO1 14 DIO2 15 DIO3 16 DIO4/CLKIN J1 Figure 22. J1Pin Assignments for the ADIS16IMU2/PCBZ The C1 and C2 locations on the ADIS16IMU2/PCBZ provide users with the pads to install 10 µF of capacitance across VDD and GND, which Figure 9 recommends for best performance. ADIS16446BMLZ ADIS16IMU2/PCBZ (INTERFACE BOARD) 33.40mm 23.75mm 20.15mm 30.10mm 10.07mm 15.05mm J1 J2 1 15 16 2 23 1 2 24 NOTES 1. USE FOUR M2 MACHINE SCREWS TO ATTACH THE ADIS16446. 2. USE FOUR M3 MACHINE SCREWS TO ATTACH THE INTERFACE PCB. 3. EITHER A SAMTEC FFSD-08-D-12.00-01-N OR FFSD-08-D-24.00-01-N CABLE ASSEMBLY CAN BE USED TO CONNECT THE ADIS16IMU2 TO THE EVAL-ADIS2Z EVALUATION BOARD. ADIS1644X/FLEX (FLEXIBILE CONNECTOR/CABLE) 15mm TO 45mm Figure 23. Physical Diagram for ADIS16446 Accessories |
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